US Patent Issued to Intel on June 16 for "Package architecture with die-to-die coupling using glass interposer" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,650, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package architecture with die-to-die coupling using glass interposer" was invented by Brandon C. Marin (Gilbert, Ariz.), Gang Duan (Chandler, Ariz.), Jeremy Ecton (Gilbert, Ariz.), Suddhasattwa Nad (Chandler, Ariz.) and Srinivas V. Pietambaram (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise: an interposer structure of glass, a substrate comprising organic dielectric material, the substrate coupled to a first side of the interposer structure; and a plurality of IC dies. A first IC die in the plurality of IC di...