US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Package base substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,652, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Package base substrate and semiconductor package including the same" was invented by Minkyeong Park (Hwaseong-si, South Korea) and Yongsung Park (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package base substrate includes a base layer; a plurality of lower surface connection pads disposed on a lower surface of the base layer; a plurality of lower surface wiring patterns disposed on a lower surface of the base layer and respectively connected to a set of lower surface connection pads of the plurality of lower surface connection...