US Patent Issued to KIOXIA on June 16 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,623, issued on June 16, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor device" was i... Read More

US Patent Issued to SK hynix on June 16 for "Semiconductor module and system including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,624, issued on June 16, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor module and system including the same" was in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor device and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,625, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Semiconductor device and method of... Read More

US Patent Issued to Micron Technology on June 16 for "Patterning of 3D NAND pillars and flying buttress supports with three stripe technique" (Idaho Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,626, issued on June 16, was assigned to Micron Technology Inc. (Boise, Idaho). "Patterning of 3D NAND pillars and flying buttress supports ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Reinforcement structures for chip-interposer and interposer-substrate bonding and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,627, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Reinforcement structures for chip-i... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,628, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure and method fo... Read More

US Patent Issued to UNITED MICROELECTRONICS on June 16 for "Method for fabricating physically unclonable function device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,629, issued on June 16, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Method for fabricating physically unclonabl... Read More

US Patent Issued to QUALCOMM on June 16 for "Detection of laser-based security attacks" (California, Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,630, issued on June 16, was assigned to QUALCOMM Inc. (San Diego). "Detection of laser-based security attacks" was invented by Alan Lewis (... Read More

US Patent Issued to SJ Semiconductor(Jiangyin) on June 16 for "Fan-out packaging structure and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,631, issued on June 16, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangsu, China). "Fan-out packaging structure and method for manu... Read More

US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Marchand baluns in coreless package substrates" (Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,632, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Marchand baluns in coreless package substrates" was invented by H... Read More

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