US Patent Issued to SJ Semiconductor(Jiangyin) on June 16 for "Fan-out packaging structure and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,631, issued on June 16, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangsu, China).

"Fan-out packaging structure and method for manufacturing same" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out packaging structure includes a first dielectric layer, a first antenna layer, a first packaging layer, a first redistribution layer, a second packaging layer, a second redistribution layer, a first conductive pillar, a second conductive pillar, a chip, and a solder bump. Two ends of the first conductive pillar connect to the first antenna layer and t...