US Patent Issued to KIOXIA on June 16 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,623, issued on June 16, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Yuichi Sano (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a wiring board, a first semiconductor chip provided on the wiring board upwards, the first semiconductor chip including a first front surface having a connection terminal electrically connected to the wiring board and a second front surface opposite the first front surface, a chip stacked body provided on the wiring board upwards, the chip stacked body including a second semiconductor chip, a sealing insul...