US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

US Patent Issued to CISCO TECHNOLOGY on April 14 for "Via and pad arrangement for printed circuit board" (Chinese, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... Read More

US Patent Issued to CISCO TECHNOLOGY on April 14 for "Via and pad arrangement for printed circuit board" (Chinese, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... Read More

US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE TECHNOLOGY GROUP on April 14 for "Display device" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,402, issued on April 14, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More

US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE TECHNOLOGY GROUP on April 14 for "Display device" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,402, issued on April 14, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More

US Patent Issued to DENSO on April 14 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,403, issued on April 14, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Hiroyoshi Kunieda (Kariya-c... Read More

US Patent Issued to DENSO on April 14 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,403, issued on April 14, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Hiroyoshi Kunieda (Kariya-c... Read More

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