US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Circuit board structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,415, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Circuit board structure and method ... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Circuit board structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,415, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Circuit board structure and method ... Read More

US Patent Issued to NAMICS on April 14 for "Laminate for wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,416, issued on April 14, was assigned to NAMICS Corp. (Niigata, Japan). "Laminate for wiring board" was invented by Naoki Obata (Niigata, ... Read More

US Patent Issued to NAMICS on April 14 for "Laminate for wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,416, issued on April 14, was assigned to NAMICS Corp. (Niigata, Japan). "Laminate for wiring board" was invented by Naoki Obata (Niigata, ... Read More

US Patent Issued to TOYO KOHAN on April 14 for "Copper clad laminate and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,417, issued on April 14, was assigned to TOYO KOHAN Co. LTD. (Tokyo). "Copper clad laminate and method for producing the same" was invente... Read More

US Patent Issued to TOYO KOHAN on April 14 for "Copper clad laminate and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,417, issued on April 14, was assigned to TOYO KOHAN Co. LTD. (Tokyo). "Copper clad laminate and method for producing the same" was invente... Read More

US Patent Issued to HS ELEKTRONIK SYSTEME on April 14 for "Printed circuit board assembly for an aircraft solid state power controller" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,418, issued on April 14, was assigned to HS ELEKTRONIK SYSTEME GMBH (Nordlingen, Germany). "Printed circuit board assembly for an aircraft... Read More

US Patent Issued to Honeywell International on April 14 for "Barrier layer for an electrical device" (North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,419, issued on April 14, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Barrier layer for an electrical device" was inve... Read More

US Patent Issued to Honeywell International on April 14 for "Barrier layer for an electrical device" (North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,419, issued on April 14, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Barrier layer for an electrical device" was inve... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Sensor package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,420, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor package structure and manufa... Read More

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