US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Circuit board structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,415, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Circuit board structure and method for manufacturing the same" was invented by Yu-Hsien Liao (Taipei City, Taiwan), Shih-Han Wu (Taipei City, Taiwan), Jhih-Wei Lai (Taipei City, Taiwan), Jian-Yu Shih (Taipei City, Taiwan) and Ming-Yen Pan (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter...