US Patent Issued to TOYO KOHAN on April 14 for "Copper clad laminate and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,417, issued on April 14, was assigned to TOYO KOHAN Co. LTD. (Tokyo).

"Copper clad laminate and method for producing the same" was invented by Nobuaki Mukai (Yamaguchi, Japan), Takahiro Yoshida (Yamaguchi, Japan) and Youhei Yoshimatsu (Yamaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of...