US Patent Issued to Zhuhai YUEXIN Semiconductor on June 9 for "Packaging structure for realizing chip interconnection and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,045, issued on June 9, was assigned to Zhuhai YUEXIN Semiconductor LLC (Zhuhai, China).

"Packaging structure for realizing chip interconnection and manufacturing method thereof" was invented by Xianming Chen (Zhuhai, China), Yejie Hong (Zhuhai, China), Benxia Huang (Zhuhai, China), Gao Huang (Zhuhai, China) and Xiaofeng Deng (Zhuhai, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure for realizing chip interconnection includes a core layer, a bridging layer, a first dielectric layer, a second dielectric layer, a first bonding pad layer and a second bonding pad layer. The first dielectric layer is arranged between the core laye...