US Patent Issued to Zhuhai ACCESS Semiconductor on Oct. 6 for "Package structure with wettable side surface and manufacturing method thereof, and vertical package module" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,784, issued on Oct. 6, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China).

"Package structure with wettable side surface and manufacturing method thereof, and vertical package module" was invented by Xianming Chen (Guangdong, China), Lei Feng (Guangdong, China), Benxia Huang (Guangdong, China) and Wenshi Wang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure with a wettable side surface and a manufacturing method thereof, and a vertical package module are disclosed. The package structure includes a first dielectric layer, a chip and a circuit layer. The first dielectric layer is provided with a ...