US Patent Issued to Zhuhai ACCESS Semiconductor on June 9 for "Packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,053, issued on June 9, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Packaging structure and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Xiaowei Xu (Guangdong, China), Gao Huang (Guangdong, China), Benxia Huang (Guangdong, China) and Wenjian Lin (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure includes multiple packaging units, and the packaging units include a hard plate region, a winding region, and a fan-out region. In the packaging structure, the hard plate region of the packaging unit is arranged in a stacked manner, some or all of the fan-out re...