US Patent Issued to Zhuhai ACCESS Semiconductor on June 30 for "Chip high-density interconnection package structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,557, issued on June 30, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Chip high-density interconnection package structure and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Yejie Hong (Guangdong, China), Gao Huang (Guangdong, China) and Benxia Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip high-density interconnection package structure includes a plate having a groove and a glass frame, a first via post penetrating the glass frame, a second via post penetrating the groove, a first line layer and a second line layer on the glass frame and electrically connected...