US Patent Issued to ZHUHAI ACCESS SEMICONDUCTOR on July 14 for "Method for manufacturing a packaging substrate, and packaging substrate" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,703, issued on July 14, was assigned to ZHUHAI ACCESS SEMICONDUCTOR Co. LTD. (Guangdong, China).

"Method for manufacturing a packaging substrate, and packaging substrate" was invented by Xianming Chen (Zhuhai City, China), Lei Feng (Zhuhai City, China), Benxia Huang (Zhuhai City, China), Wenjian Lin (Zhuhai City, China) and Gao Huang (Zhuhai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a packaging substrate, and a packaging substrate are disclosed. The method includes: providing a bottom board with a first circuit layer, the first circuit layer being provided with at least one demand point, and one side of th...