US Patent Issued to Zhuhai ACCESS Semiconductor on April 7 for "Liquid circulating cooling package substrate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,991, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Liquid circulating cooling package substrate and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Juchen Huang (Guangdong, China), Xiaowei Xu (Guangdong, China), Benxia Huang (Guangdong, China) and Gao Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, a...