US Patent Issued to ZEUS on March 3 for "Wafer processing apparatus and wafer processing method" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,799, issued on March 3, was assigned to ZEUS Co. LTD. (Hwaseong-si, South Korea).

"Wafer processing apparatus and wafer processing method" was invented by Woon Kong (Cheonan-si, South Korea), Ji Hoon Song (Cheonan-si, South Korea), Ung Jo Moon (Osan-si, South Korea), Ji Ho Park (Hwaseong-si, South Korea) and Won Seok Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, ...