ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,971, issued on April 14, was assigned to ZEON Corp. (Tokyo).
"Negative photosensitive resin composition" was invented by Takashi Tsutsumi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a negative photosensitive resin composition. The negative photosensitive resin composition contains a polymer and a photo-radical generator. The polymer includes a structural unit (I) represented by formula (I), shown below, and a structural unit (II) represented by formula (II), shown below. In formula (I), R1 to R3 each indicate, independently of one another, a hydrogen atom, an alkyl group, or an aromatic ring group, R1 to R3 may be bonded to fo...