ALEXANDRIA, Va., May 5 -- United States Patent no. 12,619,851, issued on May 5, was assigned to YUPO Corp. (Tokyo).
"Labeled molded body" was invented by Takuya Ikarashi (Ibaraki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a labeled molded body which enables a label and an RFID member to be easily separated from a molded body and to be each recycled and whose production process is simple. A labeled molded body includes a molded body and a label disposed on a surface of the molded body, and further having an RFID member disposed between the molded body and the label, wherein the molded body includes a thermoplastic resin at least in a surface layer, the label has a substrate layer includ...