ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,920, issued on Feb. 17, was assigned to YOKOWO Co. LTD. (Tokyo).
"Socket for inspecting an IC package" was invented by Daigo Takei (Gunma, Japan) and Kazuma Takeuchi (Gunma, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An IC inspection socket includes: a pin block including a plurality of contact probes; a floating plate configured to guide the IC package to be inspected; and a heating element configured to heat the IC package, in which the heating element is configured to be in contact with the IC package."
The patent was filed on March 7, 2022, under Application No. 18/284,077.
*For further information, including images, charts and table...