US Patent Issued to Yangtze Memory Technologies on March 31 for "Memory system package structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,718, issued on March 31, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).

"Memory system package structure and manufacturing method thereof" was invented by Xinru Zeng (Hubei, China), Zhen Xu (Hubei, China), Weisong Qian (Hubei, China) and Peng Chen (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory system package structure and a manufacturing method thereof are disclosed. For example, the memory system package structure can include a memory chip, a memory controller and a distribution layer. The memory chip can include a first surface. The memory controller can be positioned on the first surface. The redistri...