ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,995, issued on June 23, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).
"Package structure" was invented by Li Tao (Wuhan, China), Baohua Zhang (Wuhan, China) and Shanshan Zhao (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Examples of the present disclosure provide a package structure, the package structure including: a package substrate; a semiconductor device on the package substrate; and a molding layer over the semiconductor device, the molding layer having a plurality of grooves disposed at its surface."
The patent was filed on Aug. 2, 2023, under Application No. 18/364,217.
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