ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,299, issued on Feb. 17, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).

"Three-dimensional memory devices and fabricating methods thereof" was invented by Kun Zhang (Wuhan, China), Yuancheng Yang (Wuhan, China), Wenxi Zhou (Wuhan, China), Zhiliang Xia (Wuhan, China), Dongxue Zhao (Wuhan, China), Tao Yang (Wuhan, China), Lei Liu (Wuhan, China), Di Wang (Wuhan, China) and Zongliang Huo (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Three-dimensional (3D) memory devices and fabricating methods are disclose. A disclosed 3D memory device can comprises, a first semiconductor structure comprising an array of first type me...