US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Feb. 17 for "Memory system packaging structure, and method for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,300, issued on Feb. 17, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).

"Memory system packaging structure, and method for forming the same" was invented by Xinru Zeng (Wuhan, China), Peng Chen (Wuhan, China) and Houde Zhou (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a memory system packaging structure and fabrication methods. The memory system packaging structure includes memory modules, a memory controller, a redistribution layer electrically connected to the memory controller, a plastic encapsulation layer encapsulating the memory modules and the memory controller, and one or m...