US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 18 for "Method and apparatus for wafer bonding" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,875, issued on Aug. 18, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).

"Method and apparatus for wafer bonding" was invented by Guoliang Chen (Wuhan, China), Mengyong Liu (Wuhan, China), Yang Liu (Wuhan, China) and Wu Liu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for wafer bonding are provided. The method includes: determining a first position parameter of a first alignment mark on a first wafer and a second position parameter of a second alignment mark on a second wafer by using a first type of optical beam; moving the first wafer and the second wafer to be opposite to each other by ch...