ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,529, issued on March 31, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Resin sealing apparatus" was invented by Masahiko Fujisawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The resin sealing apparatus according to the present invention includes a press device for closing and opening an upper mold and a lower mold. The press device includes a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other one is fixed, a tie bar fixing the fixed platen and holding the movable platen so that the movable platen can be lifted and lowered, and a drive device lifting and lowering the...