ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,831, issued on June 23, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Resin sealing apparatus and sealing mold" was invented by Yudai Nomura (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a sealing mold, one of an upper mold and a lower mold is provided with one workpiece holding part that holds workpieces, and the other of the upper mold and the lower mold is provided with: clampers having structures divided from each other that individually clamp the workpieces held on the one workpiece holding part; and a cavity piece capable of moving up and down in a manner unlinked with the clamper at a central position in a plan view of...