ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,268, issued on June 2, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Compression molding device" was invented by Makoto Yanagisawa (Nagano, Japan) and Shusaku Tagami (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A compression molding device compression-molds resin to a workpiece in which components are mounted on a carrier via connection members, and produces packages each having at least one component resin-sealed therein. The compression molding device comprises: a measuring part measuring the weight of the workpiece; a calculation part calculating the supply amount of the resin based on the weight of the workpiece measured by ...