ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,999, issued on Feb. 24, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Manufacturing apparatus and manufacturing method of semiconductor device" was invented by Makoto Takahashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing apparatus of a semiconductor device includes: a stage; a bonding head, including a mounting tool, a tool heater, and a lifting and lowering mechanism; and a controller performing bonding processing. The controller performs, in the bonding processing: first processing in which, after a chip is brought into contact with a substrate, as heating of the chip is started, the chip is pressurized against the s...