US Patent Issued to Yamaha Robotics on Feb. 17 for "Semiconductor device manufacturing device and manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,600, issued on Feb. 17, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Semiconductor device manufacturing device and manufacturing method" was invented by Makoto Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "This semiconductor device manufacturing device comprises: a stage; a bonding head; a copying mechanism provided on the bonding head; and a controller that executes the copying process to adjust a facing surface to be parallel to a reference plane by having the facing surface, which is a holding surface or a chip end face, follow the reference plane 110, which is a planar surface of the stage or a substrate. In the copying p...