US Patent Issued to Yamaha Robotics on Feb. 17 for "Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereof" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,682, issued on Feb. 17, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereof" was invented by Yuichiro Noguchi (Tokyo), Alexander Dzhangirov (Tokyo) and Kohei Seyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), a...