ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,688, issued on Aug. 4, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Semiconductor device manufacturing apparatus and manufacturing method" was invented by Kohei Seyama (Tokyo) and Makoto Takahashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to t...