ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,037, issued on Aug. 4, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Bonding apparatus, bonding method, and computer readable storage medium" was invented by Kohei Seyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus includes a bonding tool, first and second imaging units, a calculation part, and a drive control part. The first and second imaging units each include an optical system and an imaging element arranged to satisfy a Scheimpflug condition such that a plane parallel to a stage surface becomes a focal plane. The calculation part calculates three-dimensional coordinates of a target point to which a bonding wire...