US Patent Issued to XILINX on June 23 for "Stress-reduced package substrate and method of forming the same" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,981, issued on June 23, was assigned to XILINX INC. (San Jose, Calif.).

"Stress-reduced package substrate and method of forming the same" was invented by Huayan Wang (Campbell, Calif.), Seungbae Park (Vestal, N.Y.), Gamal Refai-Ahmed (Santa Clara, Calif.), Suresh Ramalingam (Fremont, Calif.), Jaspreet Singh Gandhi (San Jose, Calif.), Yu Hsiang Sun (Hsin Chu, Taiwan) and Scott Mccann (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a package substrate and a method for fabricating the same. In one example, a package substrate includes a core having an outer edge and a first plurality of first interconnect layers di...