US Patent Issued to Xiamen Hongfa Electroacoustic on April 7 for "Specially packaged relay and packaging method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,574, issued on April 7, was assigned to Xiamen Hongfa Electroacoustic Co. Ltd. (Xiamen, China).

"Specially packaged relay and packaging method thereof" was invented by Yang Deng (Xiamen, China), Yiqing Zhu (Xiamen, China), Zhonghua Tan (Xiamen, China) and Rongjie Chen (Xiamen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure discloses a specially packaged relay and a packaging method thereof. The relay includes an electromagnetic relay and an injection molded body. The injection molded body is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein. A plurality of conventional termina...