US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on Sept. 1 for "Wafer matching design method, wafer bonding structure and chip bonding structure" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,486, issued on Sept. 1, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Wafer matching design method, wafer bonding structure and chip bonding structure" was invented by Beibei Sheng (Wuhan, China), Sheng Hu (Wuhan, China) and Tianjian Liu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of design for matching of wafers, a wafer bonding structure and a chip bonding structure includes: providing a first wafer including unit arrays that each include at least two first dies; providing a second wafer including second dies that each cover at least one of the unit arrays, and the second dies matched ...