US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "First chip and wafer bonding method and chip stacking structure" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,934, issued on Aug. 18, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hubei, China).

"First chip and wafer bonding method and chip stacking structure" was invented by Di Zhan (Wuhan, China), Tianjian Liu (Wuhan, China), Tian Zeng (Wuhan, China) and Wanli Guo (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of bonding first die(s) to a wafer and a die-stack structure includes: providing a first layer of first die(s), each of the first die(s) including a first metal layer; providing the wafer, which includes a second metal layer; bonding the first die(s) to the wafer; forming an insulating layer and a hole, th...