ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Shanghai Branch (Shanghai).
"Display module and substrate thereof having improved binding reliability of substrate and flexible circuit board" was invented by Qibing Wei (Shanghai), Peng Zhang (Shanghai), Xingyao Zhou (Shanghai) and Wei Liu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module and a substrate are provided in the present disclosure. The module includes an array substrate and a flexible circuit board. The array substrate includes a binding region including a first binding region and a se...