ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,802, issued on Feb. 24, was assigned to WONIK IPS Co. LTD. (Pyeongtaek-si, South Korea).
"Processing method for substrate" was invented by Won Jun Jang (Seoul, South Korea), Kyung Park (Seoul, South Korea) and Young Jun Kim (Pyeongtaek-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a substrate processing method, and more particularly, to a processing method for substrate for removing impurities from inside a thin film of a substrate and improving characteristics of the thin film."
The patent was filed on Oct. 12, 2023, under Application No. 18/486,043.
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