US Patent Issued to Wolfspeed on June 2 for "RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging" (American, Malaysian Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,647,083, issued on June 2, was assigned to Wolfspeed Inc. (Durham, N.C.).

"RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging" was invented by Alexander Komposch (Morgan Hill, Calif.), Eng Wah Woo (Ipoh, Malaysia) and Basim Noori (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A transistor device package includes a component assembly comprising an interconnect structure, a transistor die having a front surface including gate, drain, and source terminal on a first surface of the interconnect structure, and one or more passive electrical components ...