US Patent Issued to Wolfspeed on April 7 for "Multilayer encapsulation for humidity robustness and related fabrication methods" (North Carolina Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,994, issued on April 7, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Multilayer encapsulation for humidity robustness and related fabrication methods" was invented by Kyoung-Keun Lee (Cary, N.C.), Fabian Radulescu (Chapel Hill, N.C.), Scott Sheppard (Chapel Hill, N.C.) and Daniel Namishia (Wake Forest, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a semiconductor body, and a multi-layer environmental barrier on the semiconductor body. The multi-layer environmental barrier includes first and second sublayers of first and second oxide materials, respectively, where the first oxide material is different than the se...