US Patent Issued to Wistron NeWeb on Sept. 15 for "Electronic device with metallized plastic housing structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,991, issued on Sept. 15, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan).

"Electronic device with metallized plastic housing structure" was invented by Yu-Fu Kuo (Hsinchu, Taiwan), Yuan-Chin Hsu (Hsinchu, Taiwan) and Hsiao-Chan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a housing, a first metal trace, a conductive pillar, a circuit board, and a metal connecting element. The housing includes a conductive via and a concave hole, and the conductive via passes through the housing. The first metal trace is disposed on an inner surface of the housing, and the conductive via is electrically co...