US Patent Issued to Winbond Electronics on Sept. 8 for "Testing circuit for testing electrical devices and device under test" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,147, issued on Sept. 8, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Testing circuit for testing electrical devices and device under test" was invented by Lih-Wei Lin (Hsinchu City, Taiwan) and Chia-Fu Liang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A testing circuit for testing a plurality of electrical devices is provided. The testing circuit includes a first pad and a plurality of delay circuits. The first pad is disposed on a scribe line of a substrate. The first pad is configured to receive a trigger signal to trigger the electrical devices to sequentially perform a testing operation. The elec...