US Patent Issued to WINBOND ELECTRONICS on Sept. 29 for "Die package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,314, issued on Sept. 29, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Die package structure and method for forming the same" was invented by Yu-Cheng Chen (Kaohsiung City, Taiwan) and Jin-Neng Wu (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a die package structure, including disposing a plurality of dies on a carrier substrate, wherein the top surface of each die has a plurality of signal junctions. The method also includes forming a vertical wire on each of the signal junctions, forming a supporting dielectric layer on the carrier substrate, wherein the supporting dielectric lay...