US Patent Issued to Winbond Electronics on Sept. 22 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,446, issued on Sept. 22, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Shou-Chi Tsai (Tainan City, Taiwan) and Kai Jen (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method of forming the same are provided. The semiconductor structure includes a first work function layer, a second work function layer, a protective layer, a gate stack, a first liner, a second liner, a planarization layer, and a gate plug. The first work function layer is disposed on a substrate. The second work function layer is dispose...