US Patent Issued to WINBOND ELECTRONICS on May 5 for "Semiconductor structure and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,991, issued on May 5, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Shun-Li Lan (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure includes providing a substrate with an array region, a peripheral region, and a transition region between the array region and the peripheral region. A patterned floating gate layer is formed on the array region and the peripheral region, and a stacked layer is conformally formed on the substrate, wherein a recess is formed over the transition region. A photoresist l...