US Patent Issued to Winbond Electronics on May 26 for "Memory device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,779, issued on May 26, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Memory device and method of forming the same" was invented by Yuan-Hao Su (Taichung City, Taiwan), Chun-Chieh Wang (Taichung City, Taiwan) and Tzu-Ming Ou Yang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a memory device and a method of forming the same. The method includes: providing a substrate having multiple active regions; forming a first layer stack on the substrate; patterning the first layer stack to form multiple recesses in the first layer stack; forming a liner layer on the first layer stack to cover the recesses;...