ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,835, issued on March 3, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).
"Chip-on-board module" was invented by Yen-Ling Chou (Changhua, Taiwan), Bo-Ren Chi (Taichung, Taiwan) and Wei-Ting Chang (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-on-board module is provided. The chip-on-board module includes a chip and a substrate. The chip includes a plurality of chip contacts. The substrate includes a plurality of first leads and a plurality of second leads. The first leads and the second leads are coupled to a portion of the chip contacts. The first leads are arranged along a first axis. The second leads are arran...