US Patent Issued to WINBOND ELECTRONICS on March 24 for "Pick-up structure of memory device and method for manufacturing memory device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,198, issued on March 24, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Pick-up structure of memory device and method for manufacturing memory device" was invented by Hsin-Hung Chou (Taichung City, Taiwan), Cheng-Shuai Li (Taichung City, Taiwan) and Kao-Tsair Tsai (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pick-up structure of a memory device and a method of manufacturing the memory device are provided. The pick-up structure includes pick-up electrode stripes. Each pickup electrode stripe includes a main body portion in the peripheral pick-up region and an extending portion extending from the main b...