US Patent Issued to WINBOND ELECTRONICS on March 17 for "Memory device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,647, issued on March 17, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Memory device and method of manufacturing the same" was invented by Tsung-Wei Lin (Taichung City, Taiwan), Kun-Che Wu (Taichung City, Taiwan), Chun-Yen Liao (Taichung City, Taiwan) and Chun-Sheng Wu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a memory device includes providing a substrate and sequentially forming a stack layer and a hard mask layer on the substrate. The method includes forming a first patterned mandrel and a plurality of second patterned mandrels on the hard mask layer, wherein the first p...