US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same and semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure and method for forming the same and semiconductor device" was invented by Po-Chun Shao (Hsinchu City, Taiwan) and Ping-Lung Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor substrate, an insulating layer, a conductive feature and an anisotropic conductive structure. The insulating layer is disposed above the semiconductor substrate. The conductive feature is disposed in the insulating layer, wherein a top surface of the conductive feature is adjacent to a top sur...